product standards tvs diode DY2S21Z00L ? features ? absolute maximum ratings ta = 25 c peak p ulse p ower *4 peak p ulse current *4 note: *1 mounted on glass epoxy print board. ( 45 mm x 45 mm x 1 mm ) solder in. ( 0.8 mm x 0.6 mm ) *2 test method:iec61000_4_2 (c = 150 pf,r = 330 ? , contact discharge:10 times) *3 test method:iec61000_4_2 y (c = 150 pf,r = 330 ? , air discharge:10 times) *4 test method:iec61000_4_5 ( tp = 8/20 s, unrepeated ) ? electrical characteristics ta = 25 c 3 c note: 1. measuring methods are based on japanese industrial standard jis c 7031 measuring methods for diodes. 2. absolute frequency of input and output is 5 mhz. 3. *1 the temperature must be controlled 25c for vbr mesurement. vbr value measured at other temperature must be adjusted to vbr (25c) *2 vbr guaranted 20 ms after current flow. *3 8 s 20 s pulse waveform page 2. anode embossed type (thermo-compression sealing) : reverse stand-off voltage vrwm parameter symbol electrostatic discharge *2 junction temperature tj parameter symbol tstg y halogen-free / rohs compliant (eu rohs / ul-94 v-0 / msl:level 1 compliant) ? marking symbol: tv ? packaging 3 000 low capacitance DY2S21Z00L silicon epitaxial planar type for esd protection and transient voltage suppressor y low clamping voltage y iec 61000-4-2 (esd) ? 8 kv (contact) / 15 kv (air) y panasonic ssmini2-f5-b unit: mm 1. cathode jeita sc-79 unit 24 25.2 21.0 min D 22.8 0.01 vbr ir = 5ma ir vr = 21v c esd ppp 70 15 kv ipp 1.8 w a +85 c to +150 operating ambient temperature topr -40 to 10 49.4 terminal capacitance ct vr = 0 v, f = 1 mhz reverse breakdown voltage *1, *2 vc ipp = 1.8a, tp = 8/20 s reverse currentclamping voltage *3 150 low leak current total power dissipation *1 pt esd 150 mw kv y rating forward voltage vf if = 10ma c conditions storage temperature -55 pcs / reel (standard) electrostatic discharge *3 forward current if 100 ma 8 unit 3 v a v 1of pf v v internal connection code sod-523 typ max 1.0 8 s 20 s pulse waveform 1 2 100 percent of ipp 9050 10 tt1 t2 t front time:t1 = 1.25 t = 8 s20% time to half value:t2 = 20 s20% doc no. tt4-ea-14926 revision. 1 established : 2014-01-07 revised : ####-##-## downloaded from: http:///
product standards tvs diode DY2S21Z00L technical data ( reference ) page 2 of 3 pt - ta 0 50 100 150 200 0 20 40 60 80 100 120 140 160 180 200 ambient temperature ta (c) total power dissipation pt (mw) mounted on glass epoxy print board.board size : 45 mm 45 mm x 1 mm solder in : 0.8 mm x 0.6 mm ir - vbr 1.e-05 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 0 5 10 15 20 25 30 reverse breakdown voltage vbr (v) reverse current ir (a) ta = 25 ? ir - vr 1.e-13 1.e-12 1.e-11 1.e-10 1.e-09 0 5 10 15 20 reverse voltage vr (v) reverse current ir (a) ta = 25 ? ct - vr 0 2 4 6 8 10 12 14 16 0 5 10 15 20 reverse voltage vr (v) terminal capacitance ct (pf) ta = 25 ? doc no. tt4-ea-14926 revision. 1 established : 2014-01-07 revised : ####-##-## downloaded from: http:///
product standards tvs diode DY2S21Z00L unit: mm page ssmini2-f5-b ? 3 of 3 land pattern (reference) (unit: mm) ? ? ?
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doc no. tt4-ea-14926 revision. 1 established : 2014-01-07 revised : ####-##-## downloaded from: http:///
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-resident s, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to sh ow the main characteristics and application circuit examples of the products. no license is granted in and to any intellectual p roperty right or other right owned by panasonic corporation or any other c ompany. therefore, no responsibilit y is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information de-scribed in this book. (3) the products described in this book are intended to be used for general a pplications (such as office equipment, communications equipment, measuring instruments and household applian ces), or for specific applications as expressly stated in this book. please consult with our sales staff in advance for information on the follo wing applications, moreover please exchange documents separately on terms of use etc.: special applications (such as f or in-vehicle equipment, airplanes, aerospace, automotive equipment, traffic signal ing equipment, combustion equipme nt, medical equipment and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. unless exchanging documents on terms of use etc. in advance, it is to be unde rstood that our company shall not be held responsible for any damage incurred as a result of or in connection with you r using the products described in this book for any special application. (4) the products and product specific ations described in this book are sub ject to change without notice for modification and/or improvement. at the final stage of your design, purchasing, or use o f the products, therefore, ask for the most up- to-date product standards in advance t o make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maxim um rating and the guaranteed operating conditions (operating power supply v oltage and operating environment et c.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power- on, power-off and mode-switching. other- wise, we will not be liable for any defect which may arise later in your equip ment. even when the products are used withi n the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures o n the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external fact ors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. we do not guarantee quality for disassembled p roducts or the product re-mounte d after removing from the mounting board. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) when reselling products described in this book to other companies with out our permission and receiving any claim of request from the resale destination, please understand that customers wi ll bear the burden. (8) this book may be not reprinted or reproduced whether wholly or partiall y, without the prior written permission of our company. no.010618 downloaded from: http:///
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